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 SI7882DP
New Product
Vishay Siliconix
N-Channel Reduced Qg, Fast Switching MOSFET
FEATURES PRODUCT SUMMARY
VDS (V)
12
rDS(on) (W)
0.0055 @ VGS = 4.5 V 0.008 @ VGS = 2.5 V
ID (A)
22 18
D TrenchFETr Power MOSFET D New Low Thermal Resistance PowerPAKt Package with Low 1.07-mm Profile D PWM Optimized for High Efficiency
APPLICATIONS
D Point-of-Load Synchronous Rectifier - 5-V or 3.3-V BUS Step Down - Qg Optimized for 500-kHz Operation D Synchronous Buck, Shoot-Thru Resistant
D
PowerPAKt SO-8
6.15 mm
S 1 2 3 S S
5.15 mm
G 4
G
D 8 7 6 5 D D D
S N-Channel MOSFET Bottom View
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a _ Pulsed Drain Current Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction and Storage Temperature Range TA = 25_C TA = 70_C TA = 25_C TA = 70_C
Symbol
VDS VGS
10 secs
12 "8 22
Steady State
Unit
V
13 11 50 A 1.6 1.9 1.2 -55 to 150 W _C
ID IDM IS PD TJ, Tstg
18
4.1 5 3.2
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient (MOSFET)a Maximum Junction-to-Case (Drain) Notes a. Surface Mounted on 1" x 1" FR4 Board. Document Number: 71858 S-21194--Rev. C, 29-Ju1-02 www.vishay.com t v 10 sec Steady State Steady State RthJA RthJC
Symbol
Typical
20 55 2.0
Maximum
25 65 2.6
Unit
_C/W C/W
1
SI7882DP
Vishay Siliconix
New Product
MOSFET SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Forward Transconductancea Diode Forward Voltagea VGS(th) IGSS IDSS ID(on) rDS(on) gfs VSD VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "8 V VDS = 9.6 V, VGS = 0 V VDS = 9.6 V, VGS = 0 V, TJ = 70_C VDS w 5 V, VGS = 4.5 V VGS = 4.5 V, ID = 17 A VGS = 2.5 V, ID = 14 A VDS = 6 V, ID = 17 A IS = 2.7 A, VGS = 0 V 40 0.0045 0.0065 80 0.70 1.1 0.0055 0.008 S V 0.6 1.4 "100 1 5 V nA mA m A W
Symbol
Test Condition
Min
Typ
Max
Unit
Dynamicb
Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time Qg Qgs Qgd td(on) tr td(off) tf trr IF = 2.7 A, di/dt = 100 A/ms VDD = 6 V, RL = 6 W ID ^ 1 A, VGEN = 4.5 V, RG = 6 W VDS = 6 V, VGS = 4.5 V, ID = 17 A 21 4.6 3.5 28 32 82 35 60 42 48 123 53 90 ns 30 nC
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
50 VGS = 10 thru 2.5 V 40 I D - Drain Current (A) I D - Drain Current (A) 2V 30 40 50
Transfer Characteristics
30
20
20 TC = 125_C 10 25_C -55 _C 1.5 2.0 2.5
10 1.5 V 0 0 1 2 3 4 5
0 0.0
0.5
1.0
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
www.vishay.com
2
Document Number: 71858 S-21194--Rev. C, 29-Ju1-02
SI7882DP
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
0.015 4000
Vishay Siliconix
Capacitance
r DS(on) - On-Resistance ( W )
0.012 C - Capacitance (pF)
3200
Ciss
0.009 VGS = 2.5 V 0.006 VGS = 4.5 V
2400 Coss 1600
0.003
800
Crss
0.000 0 10 20 30 40 50
0 0 2 4 6 8 10 12
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Gate Charge
6 V GS - Gate-to-Source Voltage (V) VDS = 6 V ID = 17 A 1.6
On-Resistance vs. Junction Temperature
VGS = 4.5 V ID = 17 A
4
r DS(on) - On-Resistance ( W) (Normalized) 10 15 20 25 30
5
1.4
1.2
3
1.0
2
1
0.8
0 0 5
0.6 -50
-25
0
25
50
75
100
125
150
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (_C)
Source-Drain Diode Forward Voltage
50 0.040
On-Resistance vs. Gate-to-Source Voltage
TJ = 150_C 10
r DS(on) - On-Resistance ( W )
0.032
I S - Source Current (A)
0.024
0.016 ID = 17 A 0.008
TJ = 25_C
1 0.00 0.2 0.4 0.6 0.8 1.0 1.2
0.000 0 1 2 3 4 5
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Document Number: 71858 S-21194--Rev. C, 29-Ju1-02
www.vishay.com
3
SI7882DP
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
0.4 ID = 250 mA 0.2 V GS(th) Variance (V) Power (W) 200
Single Pulse Power
160
-0.0
120
-0.2
80
-0.4
40
-0.6 -50
0 -25 0 25 50 75 100 125 150 0.001 0.01 0.1 Time (sec) 1 10 TJ - Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
0.2
Notes:
0.1 0.1 0.05 0.02
t1 t2 1. Duty Cycle, D = t1 t2 PDM
2. Per Unit Base = RthJA = 67_C/W
Single Pulse 0.01 10- 4 10- 3 10- 2 10- 1 1 Square Wave Pulse Duration (sec)
3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Case
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
0.2 0.1 0.1 Single Pulse 0.05 0.02
0.01 10- 4 10- 3 10- 2 10- 1 Square Wave Pulse Duration (sec) 1 10
www.vishay.com
4
Document Number: 71858 S-21194--Rev. C, 29-Ju1-02


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